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High speed metallization for Advanced Packaging & Electronics
Our manufacturing product accelerates and enables the production of high-performance semiconductor chips
News And Resources
Our Partners
Our Technology
Our patented localized electrochemical method makes us the world's fastest and highest-performing manufacturing equipment provider
Coplanarity
Adjustable current density leads to less than 1% height variation
Reduced Steps
Reduce up to 60% steps from Semi-Additive (SAP) or (dual) Damascene manufacturing
Large Area
8'' capability today, moving to full size panel deposition
Resolution
Demonstrated 4 µm
Aiming for 1 µm
Material Quality
Up to 95% of conductivity of bulk copper
Ultra-High Efficiency
98% less embodied energy than current process
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