Syenta presents at SPIE and IMAPS 2025
- jekaterinaviktorov
- Mar 25
- 1 min read
Syenta in the US: Showcasing LEM at SPIE and IMAPS DPC 2025
The Syenta team is excited to be spending two productive weeks in the US, connecting with industry leaders and showcasing our breakthrough Localised Electrochemical Modelling (LEM) technology.
Our CTO, Ben Wilkinson, presented at SPIE Advanced Lithography + Patterning on February 24 in San Jose, highlighting how LEM combines micron-resolution stamp-based patterning with localised electrodeposition for efficient, scalable metallisation.
Ben also teamed up with our Head of Sales & BD, Sebastiaan Muller, for a joint presentation at IMAPS DPC 2025 in Phoenix on March 5 during the poster session—followed by some light-hearted fun at the 3D InCites Backyard Olympics.
Whether you're working in Advanced Packaging, MEMS, Quantum, Photonics, Medical devices—or any application requiring precise metal deposition—LEM can simplify and accelerate your process.